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Build-up Board Product List and Ranking from 8 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

Build-up Board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

  1. キョウデン Nagano//Electronic Components and Semiconductors
  2. 松和産業 本社 Mie//Electronic Components and Semiconductors
  3. 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  4. ケイツー Osaka//Electronic Components and Semiconductors
  5. 5 日本ミクロン Nagano//Electronic Components and Semiconductors
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Build-up Board Product ranking

Last Updated： Aggregation Period:May 20, 2026～Jun 16, 2026
This ranking is based on the number of page views on our site.

  1. Printed Circuit Board Manufacturing - Build-Up Boards キョウデン
  2. [Free Materials Available!] Can't Ask Now! Build-Up Substrate キョウデン
  3. Build-up substrate 松和産業 本社
  4. Support for high-density build-up structures 沖電気工業 産業営業本部　産業営業統括室
  5. 4 "0201" SMD chip compatible 6-layer (2-2-2) build-up substrate キョウデン

Build-up Board Product List

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[Free Materials Available!] Can't Ask Now! Build-Up Substrate

[Free Materials Available!] Can't Ask Now! Build-Up Substrate

We will provide a free handbook that covers the basic knowledge of build-up substrates, their benefits, and actual case studies!

Do you know what a build-up substrate is and what advantages it has? Recently, with the trend towards miniaturization of products, there has been an increase in ultra-small components such as ICs and capacitors. The demand for smaller printed circuit boards that accommodate these components is rising, and achieving this requires build-up substrates. Kyoden, which has been manufacturing build-up substrates for over 30 years and continues to accumulate know-how, will introduce the basics of build-up, its advantages, and examples of manufacturing achievements! [Contents] ■ What is a build-up substrate? ■ Features of Kyoden's build-up substrates ■ Introduction of case studies, etc. *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Build-up Board

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Printed circuit board manufacturing - build-up boards

Printed circuit board manufacturing - build-up boards

This is a method of forming a build-up layer on top of a core substrate.

The precision of printed circuit boards has advanced, leading to an increased demand for printed wiring boards using the build-up method. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, we can accommodate up to two-layer builds (two layers of build-up layers above and below). Additionally, we can also handle stack vias and filled vias. We have a track record of manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to our catalog.

  • Printed Circuit Board
  • Build-up Board

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Build-up technique

Build-up technique

Complex structures can be realized by combining machining technology, STH technology, and others!

Our build-up substrates enable complex structures through a combination of proprietary technologies (such as milling technology and STH technology), meeting the demands for high density and high functionality. We have a proven track record of drilling holes using laser vias in various materials that possess characteristics such as high heat resistance, high Tg, and chemical resistance. Additionally, our unique vacuum hot press method ensures that there are no voids in the inner layers, allowing for highly reliable build-up substrates with excellent flatness and positional accuracy between inner layer patterns. 【Features】 ■ Capable of forming laser holes directly above through holes in combination with STH technology ■ Fill via method allows laser holes to be filled with Cu plating ■ Achieves even higher density *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts
  • Build-up Board

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Build-up substrate

Build-up substrate

All processes are handled in our own factory! Just like other circuit boards, we promise ultra-short delivery times and high quality.

We would like to introduce our "Build-Up Circuit Boards." At Matsuwa Industries, we have also introduced equipment such as CO2 gas laser drilling machines, via-fill copper plating lines, and vacuum hole filling machines. We handle all processes in-house at our factory, even for high-density wiring boards like build-up boards and through resin-filled boards. Of course, just like with other boards, we guarantee ultra-short delivery times and high quality. 【Features】 ■ All processes are manufactured in-house ■ Delivery through 24-hour operations ■ Continuous introduction of new equipment ■ Realization of high-spec boards ■ No fluctuations in gold flash delivery times *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Build-up Board

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Support for high-density build-up structures

Support for high-density build-up structures

We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Build-up Board

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Printed Circuit Board Manufacturing - Build-Up Boards

Printed Circuit Board Manufacturing - Build-Up Boards

We achieve miniaturization, slimness, and high functionality of electronic devices with Kyoden's build-up substrates!

Compatible with ultra-thin build-up layer filled vias. Achieves equivalent filling properties even with build-up layers of different thicknesses. Supports thin plate formation and substrate property requirements with a highly flexible layer configuration. Compatible with 5-layer builds, full stack, and any layer. Kyoden's short delivery times also apply to build-up processes! We can deliver 1-2-1 (4-layer board) in as little as 2 days. 【Features】 ● Smaller substrate size ● Strong against noise ● Capable of carrying large currents ● High design flexibility *For more details, please download the PDF or contact us!

  • Printed Circuit Board
  • Build-up Board

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"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

Corresponding to the 'density' of components! High-frequency build-up substrate.

What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.

  • Printed Circuit Board
  • Build-up Board

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Build-up substrate

Build-up substrate

Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.

We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.

  • ビルドアップ基板2.png
  • ビルドアップ基板3.png
  • Circuit board design and manufacturing
  • Build-up Board

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Build-up PWB

Build-up PWB

Significantly improved circuit density! A substrate that enables more three-dimensional and high-density configurations.

"Build-Up PWB" mounts components on the connection via pads. Due to fewer restrictions on through holes, it significantly increases circuit density. By combining our unique machining technology, we have achieved a more three-dimensional and high-density configuration. Filled vias with copper plating are also available (subject to separate consultation). 【Features】 ■ Components mounted on connection via pads ■ Fewer restrictions on through holes ■ Significantly increases circuit density ■ Three-dimensional and high-density configuration *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Build-up Board

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Build-up substrate

Build-up substrate

Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.

We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various inter-layer connections through laser and drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various inter-layer connections through laser and drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Various substrate materials available for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Build-up Board

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Build-up substrate

Build-up substrate

Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!

We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Build-up Board

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High-reliability build-up wiring board

High-reliability build-up wiring board

High board thickness specifications, low dielectric material specifications, stack via specifications, etc.! We can accommodate various specifications.

We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Build-up Board

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